Product Specialist - Thermal Compression Bonding

Product and Technical development Support Lead and support for Thermal Compression (TCB) product setup & demo Conducts feasibility studies, sample bonding and generate report Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team, the Product Line and the R&D team Defines DOE's and experimental process trials & collects Process Data Scouts and reports new product ideas and innovation with the goal to enhance the product related to thermal compression bonding Understands the Thermal compression bonding process and knowhow to actual bonding process Understands the different process for thermal compression bonding (C2S, C2W, Flux or Fluxless) Acquires knowledge on pre and post die bonding processes Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve process or provide solutions to problems Engages in R&D projects during product definition / requirement engineering, SW test and customer product testing Deep dive and troubleshoot process related or equipment related to issues and suggest improvements in HW design/SW logic Defines SW requirements for new modules and features/Process sequence and Data/information exchange with different stakeholders. Pre- & After Sales Support Conducts evaluations, demos and generate test report and instructions Support Sales and CPMs during Pre-Sales and demo activities Establishes good customer relationship on technical level with key accounts assigned Provides Technical Info to CPMs/Sales and/or product group. Collects process / production / competitor data at customer site Technical Support, 2nd Level support Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer Investigates issues at customer site and supports Engineering team for fast and short time to solution Conducts training to FSE's and Customers Education : Degree/Masters in Mechanical/Electrical/Electronics or Mechatronic Engineering Work experience Minimum 5 years of experience in a complex Technical environment and 3 years in Product Support environment & RnD support Hands-on experience in Thermal compression bonders (TCB), Flip Chip and advance packaging Process and equipment's Expertise and methodology Matlab, JMP and statistical data analysis skills desirable Travel readiness Gurram Sravanthi EA License No.: 02C3423 Personnel Registration No.: R2197596 Your Safety and Data Security Matter to Us ManpowerGroup is committed to a safe and transparent hiring process. We will never request payment, banking details, or sensitive personal information as part of our recruitment. If you receive suspicious outreach claiming to be from us, please contact [email protected] . Please note that your response to this advertisement and subsequent communications with us will constitute informed consent to the collection, use, and disclosure of personal data by Manpower Singapore for recruitment and employment-related purposes, in compliance with the Personal Data Protection Act 2012. To learn more about ManpowerGroup's Global Privacy Policy, please visit: https://www.manpower.com.sg/privacy-policy.