Physical Design Engineer

About Us Founded in 2012, ByteDance's mission is to inspire creativity and enrich life. With a suite of more than a dozen products, including TikTok, Lemon8, CapCut and Pico as well as platforms specific to the China market, including Toutiao, Douyin, and Xigua, ByteDance has made it easier and more fun for people to connect with, consume, and create content. Why Join ByteDance Inspiring creativity is at the core of ByteDance's mission. Our innovative products are built to help people authentically express themselves, discover and connect – and our global, diverse teams make that possible. Together, we create value for our communities, inspire creativity and enrich life - a mission we work towards every day. As ByteDancers, we strive to do great things with great people. We lead with curiosity, humility, and a desire to make impact in a rapidly growing tech company. By constantly iterating and fostering an "Always Day 1" mindset, we achieve meaningful breakthroughs for ourselves, our Company, and our users. When we create and grow together, the possibilities are limitless. Join us. Diversity & Inclusion ByteDance is committed to creating an inclusive space where employees are valued for their skills, experiences, and unique perspectives. Our platform connects people from across the globe and so does our workplace. At ByteDance, our mission is to inspire creativity and enrich life. To achieve that goal, we are committed to celebrating our diverse voices and to creating an environment that reflects the many communities we reach. We are passionate about this and hope you are too. Responsibilities Team Introduction The Silicon Platform Team acts as the core R&D middleware group for chip development within the company. The team covers the full spectrum of the chip design flow, including Logic Synthesis, Design for Testability (DFT), Backend Design, Physical and STA (Static Timing Analysis) Signoff, as well as Power Integrity, IR drop, and Electromagnetic Compatibility (Power/IR/EM). The team also oversees tape-out, mass production, packaging, testing, and board-level verification. They collaborate closely with front-end chip teams across business units to drive R&D progress and mass production deployment for chip. Responsibilities 1. Own the physical implementation of one or multiple critical blocks/subsystem/SOC from netlist to GDS, including early-stage feasibility analysis. 2. Drive block/subystem/SOC PI/PV/timing signoff and ensure signoff closure. 3. Push PPA (Power, Performance, Area) optimization for high-performance cores. 4. Work closely with RTL, Synthesis, DFT, and STA teams to identify root causes and drive closure of complex implementation issues. Qualifications Minimum Qualifications 1. BS degree in Electrical Engineering, Computer Engineering, or equivalent practical experience. 2. 5+ years of experience in physical design / physical implementation. 3. Experience owning complex digital block/subsystems/SOC from netlist to tapeout. 4. Hands-on experience with industry-standard PD tools (e.g., Synopsys ICC2, Cadence Innovus). 5. Experience with floorplanning, partitioning, and cross-block timing closure. Preferred Qualifications 1. Experience with 7nm/5nm/3nm/2nm or other advanced nodes. 2. Experience owning complex block/subsystems/SOC such as AI core, or DDR/Ethernet PCS/PCIe/UCIe blocks, NOC/fabric; or CPU/GPU/NPU subsystems, NOC, memory controllers for server-level chips.